Looking for some insight on some sample preparation for PVD. We've been successfully sputtering silver onto titanium foil that has been previously chemically etched. While this yields very good adhesion, we would like to cut out any process which removes our bulk material (Ti) -- we're working with thin foils to begin with, so etching ~1um of material in order to get good sputter adhesion is bad for us.
We have access to an ion gun, a plasma cleaner, and Ti and Ag sputter targets, and (roughly) any chemical prep that someone would care to suggest. Does anyone have any insight on how to aid our adhesion? We've tried some pretty extensive ion gun runs, with and without ti adhesion layers between 10-60 nm, and we really can't even get mediocre adhesion anywhere on the substrates. Any suggestions? Currently sputtering 500nm Ag @ 40 A/s (about the upper limit on power for our application), ~8 mTorr, under argon.
Thanks in advance,